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TLV2731 датащи(PDF) 1 Page - Texas Instruments |
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TLV2731 датащи(HTML) 1 Page - Texas Instruments |
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1 / 28 page ![]() TLV2731, TLV2731Y Advanced LinCMOS ™ RAIL-TO-RAIL LOW-POWER SINGLE OPERATIONAL AMPLIFIERS SLOS198 – AUGUST 1997 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Output Swing Includes Both Supply Rails D Low Noise...15 nV/√Hz Typ at f = 1 kHz D Low Input Bias Current...1 pA Typ D Fully Specified for Single-Supply 3-V and 5-V Operation D Common-Mode Input Voltage Range Includes Negative Rail D High Gain Bandwidth...2 MHz at VDD = 5 V with 600 Ω Load D High Slew Rate... 1.6 V/µs at VDD = 5 V D Wide Supply Voltage Range 2.7 V to 10 V D Macromodel Included description The TLV2731 is a single low-voltage operational amplifier available in the SOT-23 package. It offers 2 MHz of bandwidth and 1.6 V/ µs of slew rate for applications requiring good ac performance. The device exhibits rail-to-rail output performance for increased dynamic range in single or split supply applications. The TLV2731 is fully characterized at 3 V and 5 V and is optimized for low-voltage applications. The TLV2731, exhibiting high input impedance and low noise, is excellent for small-signal conditioning of high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature with single- or split-supplies makes this family a great choice when interfacing with analog-to-digital converters (ADCs). The device can also drive 600- Ω loads for telecom applications. With a total area of 5.6mm2, the SOT-23 package only requires one-third the board space of the standard 8-pin SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal source, minimizing noise pick-up from long PCB traces. AVAILABLE OPTIONS TA VIOmax AT 25°C PACKAGED DEVICES SYMBOL CHIP FORM‡ TA VIOmax AT 25°C SOT-23 (DBV)† SYMBOL FORM‡ (Y) 0 °C to 70°C 3 mV TLV2731CDBV VALC TLV2731Y –40 °C to 85°C 3 mV TLV2731IDBV VALI TLV2731Y † The DBV package available in tape and reel only. ‡ Chip forms are tested at TA = 25°C only. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DBV PACKAGE (TOP VIEW) 5 4 3 1 2 IN + VDD+ OUT VDD– /GND IN– PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1997, Texas Instruments Incorporated Advanced LinCMOS is a trademark of Texas Instruments Incorporated. |
Аналогичный номер детали - TLV2731 |
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Аналогичное описание - TLV2731 |
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