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TLV2332 датащи(PDF) 1 Page - Texas Instruments

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номер детали TLV2332
подробное описание детали  LinCMOSE LOW-VOLTAGE MEDIUM-POWER OPERATIONAL AMPLIFIERS
PDF  33 Pages
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI - Texas Instruments

TLV2332 датащи(HTML) 1 Page - Texas Instruments

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TLV2332, TLV2332Y, TLV2334, TLV2334Y
LinCMOS
™ LOW-VOLTAGE MEDIUM-POWER
OPERATIONAL AMPLIFIERS
SLOS189 – FEBRUARY 1997
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Wide Range of Supply Voltages Over
Specified Temperature Range:
TA = –40°C to 85°C...2 V to 8 V
D Fully Characterized at 3 V and 5 V
D Single-Supply Operation
D Common-Mode Input-Voltage Range
Extends Below the Negative Rail and up to
VDD –1 V at TA = 25°C
D Output Voltage Range Includes Negative
Rail
D High Input Impedance...1012 Ω Typ
D ESD-Protection Circuitry
D Designed-In Latch-Up Immunity
description
The TLV233x operational amplifiers are in a family
of devices that has been specifically designed for
use in low-voltage single-supply applications.
Unlike the TLV2322 which is optimized for
ultra-low power, the TLV233x is designed to
provide a combination of low power and good ac
performance. Each amplifier is fully functional
down to a minimum supply voltage of 2 V, is fully
characterized, tested, and specified at both 3-V
and 5-V power supplies. The common-mode
input-voltage range includes the negative rail and
extends to within 1 V of the positive rail.
Having a maximum supply current of only 310
µA
per amplifier over full temperature range, the
TLV233x devices offer a combination of good ac
performance and microampere supply currents.
From a 3-V power supply, the amplifier’s typical
slew rate is 0.38 V/
µs and its bandwidth is
300 kHz.
AVAILABLE OPTIONS
VIOmax
PACKAGED DEVICES
CHIP FORM§
TA
VIOmax
AT 25
°C
SMALL OUTLINE†
(D)
PLASTIC DIP
(N)
PLASTIC DIP
(P)
TSSOP‡
(PW)
CHIP FORM§
(Y)
40
°Cto85°C
9 mV
TLV2332ID
TLV2332IP
TLV2332IPWLE
TLV2332Y
– 40
°C to 85°C
10 mV
TLV2334ID
TLV2334IN
TLV2334IPWLE
TLV2334Y
† The D package is available taped and reeled. Add R suffix to the device type (e.g., TLV2332IDR).
‡ The PW package is only available left-end taped and reeled (e.g., TLV2332IPWLE).
§ Chip forms are tested at 25
°C only.
Copyright
© 1997, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
LinCMOS is a trademark of Texas Instruments Incorporated.
1
2
3
4
8
7
6
5
1OUT
1IN –
1IN +
VDD–/GND
VDD
2OUT
2IN –
2IN +
1
2
3
4
8
7
6
5
1OUT
1IN–
1IN +
VDD –/GND
VDD+
2OUT
2IN –
2IN +
TLV2332
D OR P PACKAGE
(TOP VIEW)
TLV2332
PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN –
1IN +
VDD+
2IN +
2N –
2OUT
4OUT
4IN –
4IN +
VDD–/GND
3IN +
3IN –
3OUT
4OUT
4IN –
4IN +
VDD–/GND
3IN +
3IN –
3OUT
1OUT
1IN –
1IN +
VDD+
2IN +
2IN –
2OUT
1
78
14
TLV2334
D OR N PACKAGE
(TOP VIEW)
TLV2334
PW PACKAGE
(TOP VIEW)


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