TLV2221, TLV2221Y

Advanced LinCMOS

™ RAIL-TO-RAIL

VERY LOW-POWER SINGLE OPERATIONAL AMPLIFIERS

SLOS157A – JUNE 1996 – REVISED JANUARY 1997

13

POST OFFICE BOX 655303

TYPICAL CHARACTERISTICS

Figure 5

DISTRIBUTION OF TLV2221 INPUT OFFSET

VOLTAGE TEMPERATURE COEFFICIENT†

αVIO – Input Offset Voltage

Temperature Coefficient –

µV/°C

15

10

5

0

20

25

–4

–3

–2

0

1

2

3

VDD = ± 1.5 V

P Package

TA = 25°C to 125°C

–1

4

32 Amplifiers From 1 Wafer Lot

Figure 6

DISTRIBUTION OF TLV2221 INPUT OFFSET

VOLTAGE TEMPERATURE COEFFICIENT†

αVIO – Input Offset Voltage

Temperature Coefficient –

µV/°C

15

10

5

0

20

25

–4

–3

–2

0

1

2

3

VDD = ± 2.5 V

P Package

TA = 25°C to 125°C

–1

4

32 Amplifiers From 1 Wafer Lot

Figure 7

INPUT BIAS AND INPUT OFFSET CURRENTS

vs

FREE-AIR TEMPERATURE

TA – Free-Air Temperature – °C

50

40

20

10

0

90

30

25

45

65

85

70

60

80

100

105

125

VDD

± = ±2.5 V

VIC = 0

VO = 0

RS = 50 Ω

IIB

IIO

Figure 8

0

4

1

1.5

2

2.5

2

1

3

INPUT VOLTAGE

vs

SUPPLY VOLTAGE

5

3

3.5

4

–1

–2

–3

–4

–5

RS = 50 Ω

TA = 25°C

|VIO| ≤ 5 mV

|VDD

±| – Supply Voltage – V

† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.