TL2218-285, TL2218-285Y

EXCALIBUR CURRENT-MODE SCSI TERMINATOR

SLVS072C – DECEMBER 1992 – REVISED OCTOBER 1995

POST OFFICE BOX 655303

8–2

AVAILABLE OPTIONS

TJ

SURFACE MOUNT

(PW)†

CHIP FORM

(Y)

0

°C to 125°C

TL2218-285PWLE

TL2218-285Y

† The PW package is only available left-end taped and reeled.

TL2218-285Y chip information

This chip, when properly assembled, displays characteristics similar to the TL2218-285. Thermal compression

or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 11 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

Thermal

Regulation

Feedback

Active

Negation

Clamp

TERMPWR

1, 20

4

19

Vref

DISABLE

D0

Common to All Channels

161

84

(1)

(4)

(5)

(6)

(7)

(8)

(10) (11)

(13)

(14)

(16)

(17)

(19)

(20)