THS6012

500-mA DUAL DIFFERENTIAL LINE DRIVER

SLOS226C– SEPTEMBER 1998 – REVISED FEBRUARY 2000

21

POST OFFICE BOX 655303

APPLICATION INFORMATION

thermal information

The THS6012 is packaged in a thermally-enhanced DWP package, which is a member of the PowerPAD family

of packages. This package is constructed using a downset leadframe upon which the die is mounted

[see Figure 39(a) and Figure 39(b)]. This arrangement results in the lead frame being exposed as a thermal pad

on the underside of the package [see Figure 39(c)]. Because this thermal pad has direct thermal contact with

the die, excellent thermal performance can be achieved by providing a good thermal path away from the thermal

pad.

The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.

During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be

soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,

heat can be conducted away from the package into either a ground plane or other heat dissipating device. This

is discussed in more detail in the

PCB design considerations section of this document.

The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of

surface mount with the, heretofore, awkward mechanical methods of heatsinking.

DIE

Side View (a)

End View (b)

Bottom View (c)

DIE

Thermal

Pad

NOTE A: The thermal pad is electrically isolated from all terminals in the package.

Figure 39. Views of Thermally Enhanced DWP Package