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SSM9915 датащи(PDF) 2 Page - SeCoS Halbleitertechnologie GmbH |
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SSM9915 датащи(HTML) 2 Page - SeCoS Halbleitertechnologie GmbH |
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2 / 4 page ![]() Source-Drain Diode 01-Jun-2002 Rev. A Page 2 of 4 Elektronische Bauelemente Notes: 1. 2.Pulse width 300us, dutycycle 2%. ≦ ≦ 3. Surface mounted on 1 in copper pad of FR4 board. 2 Pulse width limited by safe operating area. SSM9915 6.2A, 20V,RDS(ON) 50m N-Channel Enhancement Mode Power Mos.FET Ω t 10sec. ≦ Parameter Symbol Max. Typ. Test Condition Min. Unit Forward On Voltage Reverse Recovery Time Trr _ Reverse Recovery Change _ Qrr nC nS 17 9 2.5 3 =10A, VGS=0V. VSD _ _ IS= A, VGS=0V. V 1. 2 _ _ IS dl/dt=100A/us http://www.SeCoSGmbH.com/ Any changing of specification will not be informed individual Electrical Characteristics( Tj=25 C Unless otherwise specified) o 50 _ _ 13 S VDS=10V, ID=5A _ _ Crss Reverse Transfer Capacitance Forward Transconductance Gfs 0.78 _ _ Gate Resistance Rg f=1.0MHz 5 1 2 8 55 10 3 70 nC nS pF VGS=0V VDS=20V f=1.0MHz VDD=10V ID=10A VGS=5 V RG=3.3 RD=1 Ω Ω ID=10A VDS=16V VGS= 4.5V _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 20 0.03 0.5 1.2 100 1 25 50 80 ± V V/ Reference to 25C, ID=1m o oC V nA uA uA mΩ VGS=4.5V, ID=6A VGS=2.5V, ID=4A VGS=0V, ID=250uA VGS= V ± 12 VDS=20V,VGS=0 VDS=16V,VGS=0 VDS=VGS, ID=250uA _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 360 8 580 A Total Gate Charge Qg Qgs Qgd Td(ON) Td(Off) Tr Ciss Coss Tf Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance BVDSS BVDS/ Tj IDSS Parameter Symbol Max. Typ. Test Condition Min. Unit Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Gate Threshold Voltage Gate-Source Leakage Current Drain-Source Leakage Current (Tj=25 ) Static Drain-Source On-Resistance Drain-Source Leakage Current(Tj=70 C) VGS(th) IGSS oC o 2 2 RDS(ON) 2 2 Ω |
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