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SMD15 датащи(PDF) 2 Page - SeCoS Halbleitertechnologie GmbH

номер детали SMD15
подробное описание детали  300W TVS DIODE
PDF  2 Pages
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производитель  SECOS [SeCoS Halbleitertechnologie GmbH]
домашняя страница  http://www.secosgmbh.com
Logo SECOS - SeCoS Halbleitertechnologie GmbH

SMD15 датащи(HTML) 2 Page - SeCoS Halbleitertechnologie GmbH

  SMD15 Datasheet HTML 1Page - SeCoS Halbleitertechnologie GmbH SMD15 Datasheet HTML 2Page - SeCoS Halbleitertechnologie GmbH  
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Any changing of specification will not be informed individual
http://www.SeCoSGmbH.com
Elektronische Bauelemente
0. 01
0.1
1
10
0.1
1
10
100
1000
Pulse Duration - tp (us)
Non-Repetitive Peak Pulse Power vs. Pulse Time
SMD03 THRU SMD36
300W TVS DIODE
0
10
20
30
40
50
60
70
80
90
100
110
0
25
50
75
100
125
150
Ambient Temperature - TA (oC)
Power Derating Curve
0
10
20
30
40
50
60
70
80
90
100
110
0
5
10
15
20
25
30
Time (us)
e
-t
td = IPP /2
Wave form
Paramete rs:
tr = 8 s
td = 20 s
Pulse Waveform
Applications Information
Device Connection Options
The SM series is designed to protect one
unidirectional data or l/O lines operating at 5 to
36 volts.Connection options are as follows:
Unidirectional:Data lines are connected to pin1
and Pin 3 is connected to ground.For best
results,this pin should be connected directly to a
ground plane on the board.The path lengh should
be kept as short as possible to minimize parasitic
inductance.
Circuit Board Layout Recommendations for suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of fast rise-time transients such as ESD.The following
guidelines are recommended (Refer to application note
Sl99.01 for more detailed information):
Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path toground should be
kept as short as possible.
Never run critical signals near board edges
Use ground planes whenever possib|e.
Number
1.4
4.0
mm
1.2
0.9
0.95
2.6
Suggested Solder Pad Layout
0.9
1.4
16-Oct.-2006 Rev. B
Page 2 of 2
16-Oct.-2008 Rev. D
Page 2 of 2



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