Altera Corporation

DS-CYTHRML-3.0

3

Altera Device Package Information Data Sheet

Table 3 provides board dimension information for each package.

EP3C16

E144

20

17.5

15.4

14

8

Q240

27.2

24.7

22.1

17.8

4.3

F256

28.5

25.1

23.2

21.7

9.1

U256

28.8

25.4

23.5

22

9.7

U484

26.9

23.5

21.6

20.1

8.5

F484

22.9

19.4

17.7

16.2

6.9

M164

34.7

28

26.1

24.4

9.2

EP3C25

E144

20

17.5

15.4

14

7.8

Q240

27

24.5

21.8

17.6

4.2

F256

27.5

24.1

22.2

20.7

8.5

U256

27.9

24.5

22.6

21.1

9.1

F324

26.6

23.1

21.3

19.8

8

EP3C40

Q240

25.8

23.2

20.6

17

4

F324

23.2

19.7

18

16.5

5.9

U484

22.8

19.3

17.6

16.1

5.9

F484

19.8

16.3

14.6

13.2

4.8

F780

18.7

15.2

13.5

12.2

4.5

EP3C55

F484

21.6

18.2

16.4

15

5.1

U484

18.9

15.4

13.8

12.2

4.2

F780

17.8

14.4

12.7

11.4

3.9

EP3C80

U484

20.4

16.9

15.2

13.8

4.4

F484

18

14.5

12.9

11.5

3.6

F780

16.9

13.5

11.8

10.5

3.3

EP3C120

F484

17.1

13.7

12

10.7

3.1

F780

16

12.6

11

9.7

2.8

Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 2 of 2)

Device

Package

Still Air

100 ft./min.

200 ft./min.

400 ft./min.

Table 3. PCB Dimensions Notes (1), (2)

(Part 1 of 2)

2.5 mm Thick Signal Layers

Power/Ground

Layers

Package

Dimensions

(mm)

Board

Dimensions

(mm)

F780

9

9

29

89

F484

7

7

23

83