| поискавой системы для электроныых деталей |
|
LTC4076 датащи(PDF) 13 Page - Linear Technology |
|
|
|||||||||||||||||||||||||||||
LTC4076 датащи(HTML) 13 Page - Linear Technology |
|
13 / 16 page ![]() LTC4076 13 4076fa Power Dissipation When designing the battery charger circuit, it is not neces- sary to design for worst-case power dissipation scenarios because the LTC4076 automatically reduces the charge current during high power conditions. The conditions that cause the LTC4076 to reduce charge current through thermal feedback can be approximated by considering the power dissipated in the IC. Most of the power dissipation is generated from the internal MOSFET pass device. Thus, the power dissipation is calculated to be: PD = (VIN – VBAT) • IBAT PD is the power dissipated, VIN is the input supply volt- age (either DCIN or USBIN), VBAT is the battery voltage and IBAT is the charge current. The approximate ambient temperature at which the thermal feedback begins to protect the IC is: TA = 105°C – PD • θJA TA = 105°C – (VIN – VBAT) • IBAT • θJA Example:AnLTC4076operatingfroma5Vwalladapter(on theDCINinput)isprogrammedtosupply800mAfull-scale currenttoadischargedLi-Ionbatterywithavoltageof3.3V. Assuming θJA is 40°C/W (see Thermal Considerations), the ambient temperature at which the LTC4076 will begin to reduce the charge current is approximately: TA = 105°C – (5V – 3.3V) • (800mA) • 40°C/W TA = 105°C – 1.36W • 40°C/W = 105°C – 54.4°C TA = 50.6°C The LTC4076 can be used above 50.6°C ambient, but the charge current will be reduced from 800mA. The ap- proximate current at a given ambient temperature can be approximated by: I C T V V BAT A IN BAT JA = ° 105 – ( – • ) θ Using the previous example with an ambient temperature of 60°C, the charge current will be reduced to approxi- mately: I C C V V C W C C A I mA BAT BAT = ° ° ° = ° ° = 105 60 5 3 3 40 45 68 662 – ( – . )• / / It is important to remember that LTC4076 applications do notneedtobedesignedforworst-casethermalconditions, since the IC will automatically reduce power dissipation when the junction temperature reaches approximately 105°C. Thermal Considerations In order to deliver maximum charge current under all conditions, it is critical that the exposed metal pad on the backside of the LTC4076 package is properly soldered to the PC board ground. When correctly soldered to a 2500mm2 double sided 1oz copper board, the LTC4076 has a thermal resistance of approximately 40°C/W. Failure to make thermal contact between the exposed pad on the backside of the package and the copper board will result in thermalresistancesfargreaterthan40°C/W.Asanexample, a correctly soldered LTC4076 can deliver over 800mA to a battery from a 5V supply at room temperature. Without a good backside thermal connection, this number would drop to much less than 500mA. APPLICATIO S I FOR ATIO |
|
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |