LTC2274

39

2274f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

UJ Package

40-Lead Plastic QFN (6mm

× 6mm)

(Reference LTC DWG # 05-08-1728 Rev Ø)

6.00

0.10

(4 SIDES)

NOTE:

1. DRAWING IS A JEDEC PACKAGE OUTLINE VARIATION OF (WJJD-2)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE

PIN 1 TOP MARK

(SEE NOTE 6)

PIN 1 NOTCH

R = 0.45 OR

0.35

45

CHAMFER

0.40

0.10

40

39

1

2

BOTTOM VIEW—EXPOSED PAD

4.50 REF

(4-SIDES)

4.42 0.10

4.42 0.10

4.42 0.05

4.42 0.05

0.75

0.05

R = 0.115

TYP

0.25

0.05

0.50 BSC

0.200 REF

0.00 – 0.05

(UJ40) QFN REV Ø 0406

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.70 0.05

4.50 0.05

(4 SIDES)

5.10 0.05

6.50 0.05

0.25 0.05

0.50 BSC

PACKAGE OUTLINE

R = 0.10

TYP