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LTC4447 датащи(PDF) 6 Page - Linear Technology |
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LTC4447 датащи(HTML) 6 Page - Linear Technology |
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6 / 12 page ![]() LTC4447 6 4447f BLOCK DIAGRAM PIN FUNCTIONS NC (Pins 1, 2): No Connection Required. TG (Pin 3): High Side Gate Driver Output (Top Gate). This pin swings between TS and BOOST. TS (Pin 4): High Side MOSFET Source Connection (Top Source). BG (Pin 5): Low Side Gate Driver Output (Bottom Gate). This pin swings between VCC and GND. GND (Pin 6): Chip Ground. IN (Pin 7): Input Signal. Input referenced to an internal supply baised off of VLOGIC (Pin 8) and GND (Pin 6). If this pin is floating, an internal resistive divider triggers a shutdown mode in which both BG (Pin 5) and TG (Pin 3) are pulled low. Trace capacitance on this pin should be minimized to keep the shutdown time low. VLOGIC (Pin 8): Logic Supply. This pin powers the input buffer and logic. Connect this pin to the power supply of the controller that is driving IN (Pin 7) to match input thresholds or to VCC (Pin 9) to simplify PCB routing. VCC (Pin 9): Output Driver Supply. This pin powers the low side gate driver output directly and the high side gate driver output through an internal Schottky diode con- nected between this pin and BOOST. A low ESR ceramic bypass capacitor should be tied between this pin and GND (Pin 6). BOOST (Pins 10, 11, 12): High Side Bootstrapped Supply. An external capacitor should be tied between these pins and TS (Pin 4). An internal Schottky diode is connected between VCC (Pin 9) and these pins. Voltage swing at these pins is from VCC – VD to VIN + VCC – VD, where VD is the forward voltage drop of the Schottky diode. Exposed Pad (Pin 13): Ground. The exposed pad must be soldered to PCB ground for optimal electrical and thermal performance. 10 3 4 SHOOT- THROUGH PROTECTION THREE-STATE INPUT BUFFER LEVEL SHIFTER INTERNAL SUPPLY UNDERVOLTAGE LOCKOUT UNDERVOLTAGE LOCKOUT BOOST 11 12 TG TS 5 8 BG 4447 BD VCC 7k 7k VLOGIC 9 VCC 7 IN 6 GND 13 GND |
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