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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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LT3437IDD датащи(PDF) 25 Page - Linear Technology |
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LT3437IDD датащи(HTML) 25 Page - Linear Technology |
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25 / 28 page  25 LT3437 3437fc PACKAGE DESCRIPTIO DD Package 10-Lead Plastic DFN (3mm × 3mm) (Reference LTC DWG # 05-08-1699) 3.00 ±0.10 (4 SIDES) 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2). CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 0.38 ± 0.10 BOTTOM VIEW—EXPOSED PAD 1.65 ± 0.10 (2 SIDES) 0.75 ±0.05 R = 0.115 TYP 2.38 ±0.10 (2 SIDES) 1 5 10 6 PIN 1 TOP MARK (SEE NOTE 6) 0.200 REF 0.00 – 0.05 (DD10) DFN 1103 0.25 ± 0.05 2.38 ±0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 1.65 ±0.05 (2 SIDES) 2.15 ±0.05 0.50 BSC 0.675 ±0.05 3.50 ±0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC |
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