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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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XC6419 датащи(PDF) 28 Page - Torex Semiconductor |
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XC6419 датащи(HTML) 28 Page - Torex Semiconductor |
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28 / 29 page  28/29 XC6419 Series Pd vs. Ta 0 200 400 600 800 1000 1200 25 45 65 85 105 125 Ambient Temperature Ta（℃） ● USP-6C Power Dissipation Power dissipation data for the USP-6C is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm 2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Operating temperature Board Mount (Tj max = 125℃) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 1000 85 400 100 ■PACKAGING INFORMATION (Continued) |
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