VNQ860SP datasheet(3/10 Pages) STMICROELECTRONICS

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VNQ860 / VNQ860SP

THERMAL DATA

(*) When mounted on FR4 printed circuit board with 0.5 cm2 of copper area (at least 35

µ thick) connected to all V

CC pins.

ELECTRICAL CHARACTERISTICS (8V<VCC<36V; -40

oC<Tj<150oC; unless otherwise specified)

POWER

SWITCHING (VCC=24V) (Per channel)

PROTECTIONS (Per channel)

Symbol

Parameter

Value

Unit

SO-20

PowerSO-10

Rtj-amb

Thermal resistance junction-pins

(MAX)

oC/W

Rtj-case

Thermal resistance junction-ambient (*)

(MAX)

oC/W

Rtj-pin

Thermal resistance junction-case

(MAX)

1.4

oC/W

Symbol

Parameter

Test Conditions

Min

Typ

Max

Unit

VCC

Operating supply voltage

5.5

VUSD

Undervoltage shut-down

5.5

VOV

Overvoltage shut-down

RON

On state resistance

(per channel)

IOUT=0.25A; Tj=25

IOUT=0.25A

270

540

Ω

Supply current

Off state;

VCC=24V; Tc=25

On state (all channels on)

120

µA

ILGND

Output current

VCC-VSTAT=VIN=VGND=24V

VOUT=0V

1mA

IL(off)

Off state output current

VIN=VOUT=0V

µA

IOUTleak

Off state output leakage

current

VIN=VGND=0V; VCC=VOUT=24V;

Tamb=25

240

µA

IOUTleak

Off state output leakage

current

VIN=VGND=0V; VCC=24V;

VOUT=10V; Tamb=25

100

µA

Symbol

Parameter

Test Conditions

Min

Typ

Max

Unit

tD(on)

Turn-on delay time

RL=96Ω from VIN rising edge to

VOUT =2.4V

µs

tD(off)

Turn-off delay time

RL=96Ω from VIN falling edge to

VOUT=21.6V

µs

(dVOUT/dt)on Turn-on voltage slope

RL=96Ω from VOUT=2.4V to 19.2V

0.75

/µs

(dVOUT/dt)off Turn-off voltage slope

RL=96Ω from VOUT=21.6V to 2.4V

0.25

/µs

Symbol

Parameter

Test Conditions

Min

Typ

Max

Unit

Ilim

Current limitation

0.35

0.7

1.1

T(hyst)

Thermal hysteresis

TTSD

Thermal shut-down

temperature

150

175

200

Reset temperature

135

Vdemag

Turn-off output clamp voltage IOUT=0.25A

VCC-47 VCC-52 VCC-59

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