PEMD2_PIMD2_PUMD2_7

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 07 — 24 September 2008

11 of 16

NXP Semiconductors

PEMD2; PIMD2; PUMD2

NPN/PNP resistor-equipped transistors; R1 = 22 k

Ω, R2 = 22 kΩ

9.

Packing information

[1]

For further information and the availability of packing methods, see Section 13.

[2]

T1: normal taping

[3]

T2: reverse taping

10. Soldering

Table 9.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.[1]

Type number

Package

Description

Packing quantity

3000 4000 8000 10000

PEMD2

SOT666

2 mm pitch, 8 mm tape and reel

-

-

-315

-

4 mm pitch, 8 mm tape and reel

-

-115

-

-

PIMD2

SOT457

4 mm pitch, 8 mm tape and reel; T1

[2] -115

-

-

-135

4 mm pitch, 8 mm tape and reel; T2

[3] -125

-

-

-165

PUMD2

SOT363

4 mm pitch, 8 mm tape and reel; T1

[2] -115

-

-

-135

4 mm pitch, 8 mm tape and reel; T2

[3] -125

-

-

-165

Reflow soldering is the only recommended soldering method.

Fig 14. Reflow soldering footprint PEMD2 (SOT666)

solder lands

placement area

occupied area

solder paste

sot666_fr

2.75

2.45

2.1

1.6

0.4

(6

×)

0.55

(2

×)

0.25

(2

×)

0.6

(2

×)

0.65

(2

×)

0.3

(2

×)

0.325

(4

×)

0.45

(4

×)

0.5

(4

×)

0.375

(4

×)

1.7

2

1.7

1.075

0.538

Dimensions in mm