MMBZXVCL_MMBZXVDL_SER_1

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 01 — 3 September 2008

12 of 15

NXP Semiconductors

MMBZxVCL; MMBZxVDL series

Double ESD protection diodes for transient overvoltage suppression

12. Soldering

Fig 11. Reflow soldering footprint SOT23 (TO-236AB)

Fig 12. Wave soldering footprint SOT23 (TO-236AB)

solder lands

solder resist

occupied area

solder paste

sot023_fr

0.5

(3

×)

0.6

(3

×)

0.6

(3

×)

0.7

(3

×)

3

1

3.3

2.9

1.7

1.9

2

Dimensions in mm

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot023_fw

2.8

4.5

1.4

4.6

1.4

(2

×)

1.2

(2

×)

2.2

2.6

Dimensions in mm