ABSOLUTE MAXIMUM RATINGS

1

2

3

4

8

7

6

5

NC

+V

S

Output

NC

NC

InvertingInput

NoninvertingInput

1

2

3

5

4

+V

S

InvertingInput

Output

NoninvertingInput

OPA659

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

DESIGNATOR

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

OPA659IDBVT

Tape and reel, 250

OPA659

SOT23-5

DBV

–40°C to +85°C

BZX

OPA659IDBVR

Tape and reel, 3000

OPA659IDRBT

Tape and reel, 250

OPA659

VSON-8

DRB

–40°C to +85°C

OBFI

OPA659IDRBR

Tape and reel, 3000

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

Over operating free-air temperature range (unless otherwise noted).

OPA653

UNIT

±6.5

V

Input Voltage

V

Input Current

100

mA

Output Current

100

mA

Continuous Power Dissipation

See Thermal Characteristics

–40 to +85

°C

Storage Temperature Range

–65 to +150

°C

Lead Temperature (soldering, 10s)

+260

°C

+150

°C

+125

°C

Human Body Model (HBM)

4000

V

ESD

Charge Device Model (CDM)

1000

V

Rating:

Machine Model

200

V

DRB PACKAGE

DRV PACKAGE

VSON-8

SOT23-5

(TOP VIEW)

(TOP VIEW)

Note:

NC: Not connected.

2

Submit Documentation Feedback

Copyright © 2008, Texas Instruments Incorporated

Product Folder Link(s): OPA659