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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MPC8641DEC датащи(PDF) 91 Page - Freescale Semiconductor, Inc |
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MPC8641DEC датащи(HTML) 91 Page - Freescale Semiconductor, Inc |
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91 / 140 page  MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1 Freescale Semiconductor 91 Package 16 Package This section details package parameters and dimensions. 16.1 Package Parameters for the MPC8641 The package parameters are as provided in the following list. The package type is 33 mm x 33 mm, 1023 pins. There are two package options: high-lead Flip Chip-Ceramic Ball Grid Array (FC-CBGA), and lead-free (FC-CBGA). For all package types: Die size 12.1 mm x 14.7 mm Package outline 33 mm x 33 mm Interconnects 1023 Pitch 1 mm Total Capacitor count 43 caps; 100 nF each For high-lead FC-CBGA (package option: HCTE1 HX) Maximum module height 2.97 mm Minimum module height 2.47 mm Solder Balls 89.5% Pb 10.5% Sn Ball diameter (typical2) 0.60 mm For RoHS lead-free FC-CBGA (package option: HCTE1 VU) Maximum module height 2.77 mm Minimum module height 2.27 mm Solder Balls 95.5% Sn 4.0% Ag 0.5% Cu Ball diameter (typical2) 0.60 mm 1 High-coefficient of thermal expansion 2 Typical ball diameter is before reflow |
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