MPC5533MVM80 datasheet(5/50 Pages) FREESCALE

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Electrical Characteristics

MPC5533 Microcontroller Data Sheet, Rev. 0.0

Freescale Semiconductor

3.2

Thermal Characteristics

The shaded rows in the following table indicate information specific to a four-layer board.

Maximum solder temperature 11

Lead free (Pb-free)

Leaded (SnPb)

TSDR

—

260.0

245.0

Moisture sensitivity level 12

MSL

—

1 Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,

and functional operation at the maxima is not guaranteed. Stress beyond any of the listed maxima can affect device reliability

or cause permanent damage to the device.

2 1.5 V ± 10% for proper operation. This parameter is specified at a maximum junction temperature of 150 oC.

3 All functional non-supply I/O pins are clamped to V

SS and VDDE, or VDDEH.

4 AC signal overshoot and undershoot of up to ± 2.0 V of the input voltages is permitted for an accumulative duration of

60 hours over the complete lifetime of the device (injection current not limited for this duration).

5 Internal structures hold the voltage greater than –1.0 V if the injection current limit of 2 mA is met. Keep the negative DC

voltage greater than –0.6 V on SINB during the internal power-on reset (POR) state.

6 Internal structures hold the input voltage less than the maximum voltage on all pads powered by V

DDEH supplies, if the

maximum injection current specification is met (2 mA for all pins) and VDDEH is within the operating voltage specifications.

7 Internal structures hold the input voltage less than the maximum voltage on all pads powered by V

DDE supplies, if the maximum

injection current specification is met (2 mA for all pins) and VDDE is within the operating voltage specifications.

8 Total injection current for all pins (including both digital and analog) must not exceed 25 mA.

9 Total injection current for all analog input pins must not exceed 15 mA.

10 Lifetime operation at these specification limits is not guaranteed.

11 Moisture sensitivity profile per IPC/JEDEC J-STD-020D.

12 Moisture sensitivity per JEDEC test method A112.

Table 3. MPC5533 Thermal Characteristic

Spec

MPC5533 Thermal Characteristic

Symbol

Package

Unit

208

MAPBGA

324

PBGA

Junction to ambient 1, 2, natural convection (one-layer board)

1 Junction temperature is a function of: on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other board components, and board thermal resistance.

2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board in a horizontal position.

RθJA

°C/W

Junction to ambient 1, 3, natural convection (four-layer board 2s2p)

3 Per JEDEC JESD51-6 with the board in a horizontal position.

RθJA

°C/W

Junction to ambient (@200 ft./min., one-layer board)

RθJMA

°C/W

Junction to ambient (@200 ft./min., four-layer board 2s2p)

RθJMA

°C/W

Junction to board 4 (four-layer board 2s2p)

4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

RθJB

°C/W

Junction to case 5

RθJC

810

°C/W

Junction to package top 6, natural convection

°C/W

Table 2. Absolute Maximum Ratings 1 (continued)

Spec

Characteristic

Symbol

Min.

Max.

Unit

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