VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)

of ± 0.05 ppm/°C, 35 % Space Saving versus

Wraparound Design and PCR of 5 ppm at Rated Power

www.vishay.com

For any questions, contact: foil@vishay.com

Document Number: 63106

2

Revision: 28-Jun-07

Note

• For VFCP0805, VFCP1506, VFCP2010 and VFCP2512 DSCC Drawings, please contact foil@vishay.com

Note

1. As shown + 0.01 W to allow for measurement errors at low values.

TABLE 2 - DSCC SPECIFICATIONS (Vishay resistors are listed on the following DSCC specifications)

MODEL

DSCC

MIL SPEC

VFCP1206

2009

MIL-PRF-55342

FIGURE 2 -TRIMMING TO VALUES (Conceptual Illustration)

Mutual Inductance

Reduction due

to Change in

Current Direction

Current Path

Before Trimming

Note: Foil shown in black, etched spaces in white

Interloop Capacitance

Reduction in Series

Trimming Process

Removes this Material

from Shorting Strip Area

Changing Current Path

and Increasing

Resistance

Current Path

After Trimming

TABLE 3 - SPECIFICATIONS

CHIP

SIZE

RATED

POWER

(mW)

at + 70 °C

MAXIMUM

VOLTAGE

RATING

(

≤

)

RESISTANCE

RANGE (

Ω)

MAXIMUM

WEIGHT

(mg)

0805

100 mW

34 V

10 to 12K

5.2

1206

250 mW

86 V

10 to 30K

10.3

1506

300 mW

109 V

10 to 40K

12

2010

400 mW

200 V

10 to 100K

25

2512

600 mW

220 V

10 to 150K

35

PR

×

TABLE 4 - LOAD LIFE STABILITY

(+ 70 °C FOR 2000 HOURS)

CHIP SIZE

MAXIMUM

ΔR LIMITS

0805

± 0.005 % at 50 mW

± 0.01 % at 100 mW

1206

± 0.005 % at 150 mW

± 0.01 % at 250 mW

1506

± 0.005 % at 150 mW

± 0.01 % at 300 mW

2010

± 0.005 % at 200mW

± 0.01 % at 400 mW

2512

± 0.005 % at 500 mW

± 0.01 % at 600 mW

TABLE 5 - PERFORMANCES

TEST OR CONDITION

MIL-PRF-55342

CHARACTERISTIC E

ΔR LIMITS

TYPICAL

ΔR LIMITS

MAXIMUM

Thermal Shock

± 0.1 %

± 0.005 % (50 ppm)

± 0.01 % (100 ppm)

Low Temperature Operation

± 0.1 %

± 0.005 % (50 ppm)

± 0.01 % (100 ppm)

Short Time Overload

± 0.1 %

± 0.005 % (50 ppm)

± 0.01 % (100 ppm)

High Temperature Exposure

± 0.1 %

± 0.01 % (100 ppm)

± 0.02 % (200 ppm)

Resistance to Soldering Heat

± 0.2 %

± 0.005 % (50 ppm)

± 0.015 % (150 ppm)

Moisture Resistance

± 0.2 %

± 0.005 % (50 ppm)

± 0.02 % (200 ppm)

Load Life Stability + 70 °C for 2000 hours

at Rated Power

± 0.5 %

± 0.005 % (50 ppm)

± 0.01 % (100 ppm)