PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

OPA2341DGSA/250

ACTIVE

MSOP

DGS

10

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

OPA2341DGSA/250G4

ACTIVE

MSOP

DGS

10

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

OPA341NA/250

ACTIVE

SOT-23

DBV

6

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

OPA341NA/250G4

ACTIVE

SOT-23

DBV

6

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

OPA341NA/3K

ACTIVE

SOT-23

DBV

6

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

OPA341NA/3KG4

ACTIVE

SOT-23

DBV

6

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

OPA341UA

ACTIVE

SOIC

D

8

100

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

OPA341UAG4

ACTIVE

SOIC

D

8

100

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

PACKAGE OPTION ADDENDUM

www.ti.com

5-May-2008

Addendum-Page 1