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Document Number: 28751

280

Revision: 11-Sep-08

ACAC 0612, ACAS 0612 - Precision

Vishay Beyschlag

Precision Thin Film Chip Resistor Array

TESTS AND REQUIREMENTS

Essentially all tests are carried out in accordance with the

following specifications:

EN 60115-1, Generic specification (includes tests)

EN 140400, Sectional specification (includes schedule for

qualification approval)

The testing also covers most of the requirements specified

by EIA/IS-703 and JIS-C-5202.

The tests are carried out in accordance with IEC 60068*

and under standard atmospheric conditions according to

IEC 60068-1*, 5.3. Climatic category LCT/UCT/56 (rated

temperature range: Lower Category Temperature, Upper

Category Temperature; damp heat, long term, 56 days) is

valid.

Unless otherwise specified the following values apply:

Temperature: 15 °C to 35 °C

Relative humidity: 45 % to 75 %

Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)

In the following table only the tests and requirements are

listed with reference to the relevant clauses of EN 60115-1

and IEC 60068-2*; a short description of the test procedure

is also given.

Notes

•

The quoted IEC standards marked with an asterisk (*) are also released as EN standards with the same number and identical contents

TEST PROCEDURES AND REQUIREMENTS

EN

60115-1

CLAUSE

IEC

60068-2*

TEST

METHOD

TEST

PROCEDURE

PERMISSIBLE CHANGE (

ΔR)

Stability for product types:

ACAC 0612, ACAS 0612

47

Ω to 221 kΩ

Climatic category

(LCT/UCT/duration)

- 55 °C/+ 125 °C/56 days

4.5

-

Resistance

-

± 0.5 %; ± 0.25 %

4.8.4.2

-

Temperature coefficient

At 20/LCT/ 20

°C and

20/UCT/20

°C

± 50 ppm/K; ± 25 ppm/K

4.25.1

-

Endurance

U =

1.5 h on; 0.5 h off;

70

°C; 1000 h

± (0.25 % R + 0.05

Ω)

4.25.3

-

Endurance at upper

category temperature

125

°C; 1000 h

± (0.25 % R + 0.05

Ω)

4.24

78 (Cab)

Damp heat,

steady state

(40 ± 2)

°C; 56 days;

(93 ± 3) % RH

± (0.25 % R + 0.05

Ω)

4.13

-

U = 2.5 x

or

± (0.1 % R + 0.01

Ω)

no visible damage

4.19

14 (Na)

Rapid change of

temperature

30 min at LCT and

30 min at UCT;

5 cycles

± (0.1 % R + 0.01

Ω)

no visible damage

4.18.2

58 (Td)

Resistance to soldering

heat

Reflow method 2

(IR/forced gas convention);

(260 ± 5)

°C;

(10 ± 1) s

± (0.1 % R + 0.01

Ω)

no visible damage

4.17.2

58 (Td)

Solderability

Solder bath method;

SnPb; non-activated flux

accelerated ageing 4 h/155 °C

(215 ± 3)

°C; (3 ± 0.3) s

Good tinning (

≥ 95 % covered);

no visible damage

Solder bath method;

SnAgCu; non-activated flux

accelerated ageing 4 h/155 °C

(235 ± 3)

°C; (2 ± 0.2) s

4.32

Shear (adhesion)

45 N

No visible damage

4.33

Substrate bending

Depth 2 mm, 3 times

± (0.1 % R + 0.01

Ω)

no visible damage;

no open circuit in bent position

4.7

-

Voltage proof

60 ± 5 s; against ambient,

between adjacent resistors

No flashover or breakdown

P

P