PRACTICAL CONSIDERATIONS

Printed circuit board

The layout shown in Fig. 16 should be adopted by

the designers. If different layouts are used, the

ground points of input 1 and input 2 must be well

decoupled from the ground return of the output in

which a high current flows.

Assembly suggestion

No electrical isolation is needed between the

packageand the heatsinkwith single supply voltage

configuration.

Application suggestions

The recommended values of the components are

those shown on application circuit of fig. 13.

Different values can be used. The following table

can help the designer.

Componen t

Recomm.

value

Purpose

Larger than

recommended value

Smaller than

recommended value

R1

22 k

Ω

Closed loop gain

setting

Increase of gain

Decrease of gain (*)

R2

680

Ω

Closed loop gain

setting

Decrease of gain (*)

Increase of gain

R3

22 k

Ω

Non inverting input

biasing

Increase of input

impedance

Decrease of input

impedance

R4

1

Ω

Frequency stability

Danger of osccilat. at

high frequencies

with induct. loads

R5

≅ 3 R2

Upper frequency

cutoff

Poor high frequencies

attenuation

Danger of

oscillation

C1

1

µF

Input DC

decoupling

Increase of low

frequencies cutoff

C2

22

µF

Inverting DC

decoupling

Increase of low

frequencies cutoff

C3, C4

0.1

µF

Supply voltage

bypass

Danger of

oscillation

C5, C6

100

µF

Supply voltage

bypass

Danger of

oscillation

C7

0.22

µF

Frequency stability

Danger of oscillation

C8

≅

1

2

π BR1

Upper frequency

cutoff

Smaller bandwidth

Larger bandwidth

D1, D2

1N4001

To protect the device against output voltage spikes

(*) Closed loop gain must be higher than 24dB

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TDA2030