Copyright

© ANPEC Electronics Corp.

Rev. A.1 - Apr., 2008

APW7128

www.anpec.com.tw

2

Symbol

Parameter

Rating

Unit

VIN pin to GND

-0.3 to 30

V

LX pin to PGND

-0.3 to 30

V

OVP pin to GND

-0.3 to 30

V

BP pin to GND

-0.3 to 6

V

EN pin to GND

-0.3 to 30

V

ALS pin to GND

-0.3 to 6

V

PGND to GND

-0.3 to 0.3

V

Maximum Junction Temperature

150

°C

Storage Temperature Range

-65 to 150

°C

Maximum Lead Soldering Temperature, 10 Seconds

260

°C

Recommended Operating Conditions

Symbol

Parameter

Rating

Unit

VIN Supply Voltage, (VIN=BP)

2.7 to 5.5

V

VIN Supply Voltage, (BP is open)

3.7 to 21V

V

Output Voltage

up to 30

V

Operating Ambient Temperature

-40 to 85

°C

Operating Junction Temperature

-40 to 125

°C

Electrical Characteristics

Symbol

Parameter

Test Conditions

Min

Typ

Max

Unit

INPUT SUPPLY CURRENT AND UVLO

BP Under Voltage Lockout

Threshold

2.4

2.5

2.6

V

UVLO Hysteresis

-

100

-

mV

EN=5V, switching

-

9

15

mA

VIN Supply Current

EN=0V

-

-

1

uA

ERROR AMPLIFIER

gm

Error Amplifier Transconductance

-

350

-

uA/V

COMP Output Current

-

50

-

uA

FB Voltage

485

500

515

mV

Symbol

Parameter

Package

Typical Value

Unit

θ

JA

Junction to Ambient Thermal Resistance

in Free Air

DFN3x3-10

80

°C/W

Note 2:

θ

is soldered directly on the PCB.

Note 1: Stresses beyond the absolute maximum rating may damage the device and exposure to absolute maximum rating conditions

for extended periods may affect device reliability.