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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MMA7360L_0708 датащи(PDF) 7 Page - Freescale Semiconductor, Inc |
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MMA7360L_0708 датащи(HTML) 7 Page - Freescale Semiconductor, Inc |
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7 / 10 page  Sensors Freescale Semiconductor 7 MMA7360L MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS PCB Mounting Recommendations MEMS based sensors are sensitive to Printed Circuit Board (PCB) reflow processes. For optimal zero-g offset after PCB mounting, care must be taken to PCB layout and reflow conditions. Reference application note AN3484 for best practices to minimize the zero-g offset shift after PCB mounting. Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self-align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 6x2 12x1 14x0.9 14x0.6 10x0.8 1 13 6 8 |
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