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MMA7331LR2 датащи(PDF) 8 Page - Freescale Semiconductor, Inc

номер детали MMA7331LR2
подробное описание детали  짹4g, 짹12g Three Axis Low-g Micromachined Accelerometer
PDF  11 Pages
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производитель  FREESCALE [Freescale Semiconductor, Inc]
домашняя страница  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MMA7331LR2 датащи(HTML) 8 Page - Freescale Semiconductor, Inc

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Sensors
8
Freescale Semiconductor
MMA7331L
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
PCB Mounting Recommendations
MEMS based sensors are sensitive to Printed Circuit
Board (PCB) reflow processes. For optimal zero-g offset after
PCB mounting, care must be taken to PCB layout and reflow
conditions. Reference application note AN3484 for best
practices to minimize the zero-g offset shift after PCB
mounting.
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package.
With the correct footprint, the packages will self-align when
subjected to a solder reflow process. It is always
recommended to design boards with a solder mask layer to
avoid bridging and shorting between solder pads.
Figure 8. LGA 14-Lead, 5 x 3 mm Die Sensor
6x2
12x1
14x0.9
14x0.6
10x0.8
1
13
6
8



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