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STW5095 датащи(PDF) 71 Page - STMicroelectronics

номер детали STW5095
подробное описание детали  Low-power asynchronous stereo audio Codec with integrated power amplifiers
PDF  73 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STW5095 датащи(HTML) 71 Page - STMicroelectronics

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Package outline
STw5095
70/72
19
Package outline
Figure 33.
Package mechanical data
Note:
1
The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink
or metallized markings, or other feature of package body or integral heatslug. A
distinguishing feature is allowable on the bottom surface of the package to identify the
terminal A1 corner. Exact shape of each corner is optional.
Table 29.
Package dimensions (mm)
Ref.
Min.
Typ.
Max.
Outline and mechanical data
A (1)
1.
The total profile height is measured from the seating plane to the top of the component.
1.010
1.200 (2)
2.
Max mounted height is 1.12mm.Based on a 0.28mm ball pad diameter. Solder paste is 0.15mm thickness and 0.28mm
diameter.
A1
0.150
A2
0.820
b
0.250
0.300
0.350
D
4.850
5.000
5.150
D1
3.500
E
4.850
5.000
5.150
E1
3.500
e
0.450
0.500
0.550
f
0.600
0.750
0.900
TFBGA 5x5x1.20 64 F8x8 0.50
Thin Profile Fine Pitch Ball Grid Array
ddd
0.080
ddd
C
C
A1
A
A2
ef
D1
D
H
G
F
E
D
C
B
A
12345678
A1 CORNER INDEX AREA
Øb (64 BALLS)
PLANE
SEATING
BOTTOM VIEW
See
Note 1



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