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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STW4810 датащи(PDF) 73 Page - STMicroelectronics |
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STW4810 датащи(HTML) 73 Page - STMicroelectronics |
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73 / 79 page  Package mechanical data STw4810 72/78 7 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7.1 TFBGA 84 balls See Figure 16: TFBGA 84 balls 6x6x1.2mm body size / 0.5 ball pitch drawing. Table 55. TFBGA 84 balls 6x6x1.2mm body size / 0.5 ball pitch dimensions(1) 1. These measurements conform to JEDEC standards Drawing dimensions (mm) Min. Typ. Max. A 1.16 A1 0.20 0.25 0.30 A2 0.82 b 0.250.300.35 D 5.906.006.10 D1 4.50 E 5.906.006.10 E1 4.50 e 0.450.500.55 f 0.650.750.85 ddd 0.08 |
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