Preliminary Technical Data

ADP2503/ADP2504

OUTLINE DIMENSIONS

TOP VIEW

10

1

6

5

0.30

0.23

0.18

*EXPOSED

PAD

(BOTTOM VIEW)

PIN 1 INDEX

AREA

3.00

BSC SQ

SEATING

PLANE

0.80

0.75

0.70

0.20 REF

0.05 MAX

0.02 NOM

0.80 MAX

0.55 NOM

1.74

1.64

1.49

2.48

2.38

2.23

0.50

0.40

0.30

0.50 BSC

PIN 1

INDICATOR

(R 0.20)

*PADDLE CONNECTED TO GND.

Figure 298. 10-Lead Lead Frame Chip Scale Package [LFCSP_WD]

3 mm × 3 mm Body, Very Very Thin, Dual Lead

(CP-10-9)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Voltage

Maximum

Current

Temperature

Range

Package Description

Package

Option

Branding

2.8 V

0.6 A

−40°C to +85°C

10-Lead Lead Frame Chip Scale Package [LFCSP_WD]

CP-10-9

L9Y

3.3 V

0.6 A

−40°C to +85°C

10-Lead Lead Frame Chip Scale Package [LFCSP_WD]

CP-10-9

L9Z

3.5 V

0.6 A

−40°C to +85°C

10-Lead Lead Frame Chip Scale Package [LFCSP_WD]

CP-10-9

LAP

4.2 V

0.6 A

−40°C to +85°C

10-Lead Lead Frame Chip Scale Package [LFCSP_WD]

CP-10-9

LA0

4.5 V

0.6 A

−40°C to +85°C

10-Lead Lead Frame Chip Scale Package [LFCSP_WD]

CP-10-9

LA1

5.0 V

0.6 A

−40°C to +85°C

10-Lead Lead Frame Chip Scale Package [LFCSP_WD]

CP-10-9

LA2

2.8 V

1 A

−40°C to +85°C

10-Lead Lead Frame Chip Scale Package [LFCSP_WD]

CP-10-9

L9T

3.3 V

1 A

−40°C to +85°C

10-Lead Lead Frame Chip Scale Package [LFCSP_WD]

CP-10-9

L85

3.5 V

1 A

−40°C to +85°C

10-Lead Lead Frame Chip Scale Package [LFCSP_WD]

CP-10-9

LAN

4.2 V

1 A

−40°C to +85°C

10-Lead Lead Frame Chip Scale Package [LFCSP_WD]

CP-10-9

L9U

4.5 V

1 A

−40°C to +85°C

10-Lead Lead Frame Chip Scale Package [LFCSP_WD]

CP-10-9

L9V

5.0 V

1 A

−40°C to +85°C

10-Lead Lead Frame Chip Scale Package [LFCSP_WD]

CP-10-9

L9W

Rev. PrB | Page 15 of 16