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AAT3603 датащи(PDF) 3 Page - Advanced Analogic Technologies

номер детали AAT3603
подробное описание детали  Total Power Solution for Portable Applications
PDF  35 Pages
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производитель  ANALOGICTECH [Advanced Analogic Technologies]
домашняя страница  http://www.analogictech.com
Logo ANALOGICTECH - Advanced Analogic Technologies

AAT3603 датащи(HTML) 3 Page - Advanced Analogic Technologies

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AAT3603178
Total Power Solution for Portable Applications
PRODUCT DATASHEET
3603.2008.06.1.0
3
www .analogictech.com
AAT3603178
Total Power Solution for Portable Applications
PRODUCT DATASHEET
3603.2008.06.1.0
3
www .analogictech.com
Pin Descriptions
Pin #
Symbol
Function
1
EN_TEST
Similar to EN_HOLD but intended for use with the automatic tester or as a hands free enable input pin indi-
cating hands free phone operation with a headset. It is also internally pulled to GND when floating.
2
EN_HOLD
Enable for the system. EN_HOLD must be held high by the processor to maintain core power. It is internally
pulled to GND when floating.
3
EN_KEY
Enable for the system. An internal pull-up resistor keeps the pin pulled up to an internal supply to keep the
system off when there is no CHGIN input. Connect a normally-open pushbutton switch from this pin to GND.
There is an internal 300ms debounce delay circuit to filter noise.
4
ON_KEY
Buffered logic output of the EN_KEY pin with a logic signal from ground to OUT1.
5
EN2
Enable for LDO2 (PowerAnalog or PLL). (Internally pulled low when floating)
6
EN3
Enable for LDO3 (TCXO). (Internally pulled low when floating)
7
EN4
Enable for LDO4 (TX) (Internally pulled low when floating)
8
EN5
Enable for LDO5 (RX) (Internally pulled low when floating)
9
OUT5
Output for LDO5 (RX) (when shut down, pulled down with 10kΩ)
10
OUT4
Output for LDO4 (TX) (when shut down, pulled down with 10kΩ)
11
AVIN2
Analog voltage input. Must be tied to BAT on the PCB.
12
OUT3
Output for LDO3 (TCXO)
13
OUT2
Output for LDO2 (PowerAnalog)
14
AVIN1
Analog voltage input. Must be tied to BAT on the PCB.
15
OUT1
Output for LDO1 (PowerDigital)
16
AGND
Signal ground
17
CNOISE
Noise Bypass pin for the internal reference voltage. Connect a 0.01μF capacitor to AGND.
18
RESET
RESET is the open drain output of a 50ms reset timer. RESET is released after the 50ms timer times out.
RESET is active low and is held low during shutdown. RESET should be tied to a 10K or larger pullup to
OUTBUCK.
19
ADPP
Open Drain output. Will pull low when VCHGIN > 4.5V. When this happens, depending on the status of the
USE_USB pin, the charge current will be reset to the default values (see Battery Charger and I2C Serial
Interface and Programmability section)
20
LX
Step-down Buck converter (Core) switching node. Connect an inductor between this pin and the output.
21
PGND
Power Ground for step-down Buck converter (Core)
22
PVIN
Input power for step-down Buck converter (Core). Must be tied to BAT.
23
OUTBUCK
Feedback input for the step-down Buck converter (Core)
24, 25
N/C
No Connect; do not connect anything to these pins.
26, 27
BAT
Connect to a Lithium Ion battery.
28, 29
CHGIN
Power input from either external adapter or USB port.
30
ENBAT
Active low enable for the battery charger (Internally pulled low when floating)
31
TS
Battery Temperature Sense pin with 75μA output current. Connect the battery’s NTC resistor to this pin and
ground.
32
ISET
Charge current programming input pin (Tie a 1k to GND for maximum fast charge current). Can be used to
monitor charge current.
33
CT
Charger Safety Timer Pin. A 0.1μF ceramic capacitor should be connected between this pin and GND. Con-
nect directly to GND to disable the timer function.
34
STAT
Battery charging status pin output. Connected internally between GND and OUT1 (PowerDigital). Used to
monitor battery charge status.
35
SDA
I2C serial data pin, open drain; requires a pullup resistor.
36
SCL
I2C serial clock pin, open drain; requires a pullup resistor.
EP
EP
The exposed thermal pad (EP) must be connected to board ground plane and pins 16 and 21. The ground
plane should include a large exposed copper pad under the package for thermal dissipation (see package
outline).



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