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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TS4994FC датащи(PDF) 32 Page - STMicroelectronics |
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TS4994FC датащи(HTML) 32 Page - STMicroelectronics |
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32 / 35 page  Package information TS4994FC 32/35 5 Package information In order to meet environmental requirements, STMicroelectronics offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: www.st.com. Flip-chip package (9 bumps) Dimensions in millimeters unless otherwise indicated. Figure 99. Pinout (top view) Figure 100. Marking (top view) * Balls are underneath V IN+ V O- V CC V IN- V O+ Gnd 1 2 3 76 5 4 8 Bypass Stdby Stdby Mode 9 V IN+ V O- V CC V IN- V O+ Gnd 1 2 3 76 5 4 8 Bypass Stdby Stdby Mode 9 A94 YWW E A94 YWW E |
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