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T25 датащи(PDF) 5 Page - STMicroelectronics

номер детали T25
подробное описание детали  25 A standard and Snubberless triacs
PDF  12 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

T25 датащи(HTML) 5 Page - STMicroelectronics

  T25 Datasheet HTML 1Page - STMicroelectronics T25 Datasheet HTML 2Page - STMicroelectronics T25 Datasheet HTML 3Page - STMicroelectronics T25 Datasheet HTML 4Page - STMicroelectronics T25 Datasheet HTML 5Page - STMicroelectronics T25 Datasheet HTML 6Page - STMicroelectronics T25 Datasheet HTML 7Page - STMicroelectronics T25 Datasheet HTML 8Page - STMicroelectronics T25 Datasheet HTML 9Page - STMicroelectronics Next Button
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BTA24, BTB24, BTA25, BTA26, BTB26, T25
Characteristics
5/12
Figure 7.
Non-repetitive surge peak on-state
current for a sinusoidal pulse with
width tp < 10 ms and corresponding
value of I2t
Figure 8.
Relative variation of gate trigger
current, holding current and
latching current versus junction
temperature (typical values)
0.01
0.10
1.00
10.00
100
1000
3000
I
(A), I t (A s)
TSM
22
t (ms)
p
T initial=25°C
j
ITSM
dI/dt limitation:
50A/µs
I t
2
-40
-20
0
20
40
60
80
100
120
140
0.0
0.5
1.0
1.5
2.0
2.5
T (°C)
j
I,I ,I [T ] /
GT H L
j
I
,I ,I [T =25°C]
GT H L
j
IGT
IH & IL
Figure 9.
Relative variation of critical rate of
decrease of main current versus
(dV/dt)c (typical values)
Figure 10.
Relative variation of critical rate of
decrease of main current versus Tj
Figure 11.
D2PAK thermal resistance junction to
ambient versus copper surface under
tab (printed circuit board FR4, copper
thickness: 35 µm)
0.1
1.0
10.0
100.0
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
(dV/dt)c (V/µs)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
T2535/CW/BW
B
0
25
50
75
100
125
0
1
2
3
4
5
6
(dI/dt)c [T ] /
pecified]
j
(dI/dt)c [T s
j
T (°C)
j
0
4
8
12
16
20
24
28
32
36
40
0
10
20
30
40
50
60
70
80
S(cm²)
R
(°C/W)
th(j-a)
DPAK
2



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