TL084

Package information

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5

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 25.

TSSOP14 package mechanical data

Ref.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

1.2

0.047

A1

0.05

0.15

0.002

0.004

0.006

A2

0.8

1

1.05

0.031

0.039

0.041

b

0.19

0.30

0.007

0.012

c

0.09

0.20

0.004

0.0089

D

4.9

5

5.1

0.193

0.197

0.201

E

6.2

6.4

6.6

0.244

0.252

0.260

E1

4.3

4.4

4.48

0.169

0.173

0.176

e

0.65 BSC

0.0256 BSC

K

0°8°

0°8°

L

0.45

0.60

0.75

0.018

0.024

0.030

c

E

b

A2

A

E1

D

1

PIN 1 IDENTIFICATION

A1

L

K

e