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STCD1020 датащи(PDF) 14 Page - STMicroelectronics

номер детали STCD1020
подробное описание детали  Multi-channel clock distribution circuit
PDF  40 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STCD1020 датащи(HTML) 14 Page - STMicroelectronics

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Maximum rating
STCD1020, STCD1030, STCD1040
14/40
4
Maximum rating
Stressing the device above the rating listed in the "Absolute maximum ratings" table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 4.
Absolute maximum ratings (1.8 V supply)
Symbol
Parameter
Value
Unit
TSTG
Storage temperature (VCC off)
-55 to 150
°C
TSLD
(1)
1.
Reflow at peak temperature of 255°C to 260°C for < 30 seconds (total thermal budget not to exceed 180°C
for between 90 to 150 seconds).
Lead solder temperature for 10 seconds
260
°C
TJ
Maximum junction temperature
150
°C
VCC
Supply voltage
-0.3 to 3.6
V
VIN
Input voltage level
-0.3 to 3.6
V
VEN
Voltage on enable pins
-0.3 to 3.6
V
θ
JA
Thermal resistance (junction to ambient)
TDFN8
149.0
°C/W
TDFN10
136.6
°C/W
TDFN12
132.4
°C/W
Table 5.
Absolute maximum ratings (2.8 V supply)
Symbol
Parameter
Value
Unit
TSTG
Storage temperature (VCC off)
-55 to 150
°C
TSLD
(1)
1.
Reflow at peak temperature of 255°C to 260°C for < 30 seconds (total thermal budget not to exceed 180°C
for between 90 to 150 seconds).
Lead solder temperature for 10 seconds
260
°C
TJ
Maximum junction temperature
150
°C
VCC
Supply voltage
-0.3 to 6
V
VIN
Input voltage level
-0.3 to 6
V
VEN
Voltage on enable pins
-0.3 to 6
V
θ
JA
Thermal resistance (junction to ambient)
TDFN8
149.0
°C/W
TDFN10
136.6
°C/W
TDFN12
132.4
°C/W



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