Maximum rating

M41T81S

22/31

4

Maximum rating

Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in the Operating sections of

this specification is not implied. Exposure to Absolute Maximum Rating conditions for

extended periods may affect device reliability. Refer also to the STMicroelectronics SURE

Program and other relevant quality documents.

Table 6.

Absolute maximum ratings

Note:

For SO8 package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C

(total thermal budget not to exceed 245°C for greater than 30 seconds).

For SO8 package, standard (SnPb) lead finish: Reflow at peak temperature of 240°C (total

thermal budget not to exceed 180°C for between 90 to 150 seconds).

The SOX18 package has Lead-free (Pb-free) lead finish, but cannot be exposed to peak

reflow temperature in excess of 240°C (use same reflow profile as standard (SnPb) lead

finish).

Caution:

Negative undershoots below –0.3 volts are not allowed on any pin while in the Battery Back-

up Mode

Sym

Parameter

Value

Unit

Oscillator Off)

SOIC

–55 to 125

°C

Supply Voltage

–0.3 to 7

V

Lead Solder Temperature for 10

Seconds

Lead-free lead

260

°C

Standard (SnPb)

240

°C

Input or Output Voltages

–0.3 to Vcc+0.3

V

Output Current

20

mA

Power Dissipation

1

W