ADT6401/ADT6402

Rev. 0 | Page 4 of 12

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

−0.3 V to +7 V

S0, S1, S2 Input Voltage to GND

Open-Drain Output Voltage to GND

−0.3 V to +7 V

Push-Pull Output Voltage to GND

Input Current on All Pins

20 mA

Output Current on All Pins

20 mA

ESD rating (HBM)

1.5 kV

Operating Temperature Range

−55°C to +125°C

Storage Temperature Range

−65°C to +160°C

150.7°C

6-Lead SOT-23 (RJ-6)

Power Dissipation1

Thermal Impedance3

229.6°C/W

IR Reflow Soldering (RoHS-Compliant

Package)

Peak Temperature

260°C (+0°C)

Time at Peak Temperature

20 sec to 40 sec

Ramp-Up Rate

3°C/sec maximum

Ramp-Down Rate

−6°C/sec maximum

Time 25°C to Peak Temperature

8 minute maximum

preferential flow direction, for example, components mounted on a

heat sink. Junction-to-ambient resistance is more useful for air-cooled,

PCB-mounted components.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

0.9

0

125

TEMPERATURE (°C)

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

–55

–50

–40

–30

–20

–10

0

10

20

30

40

50

60

70

80

90

100

110

120

SOT-23 PD @ 125°C = 0.107W

Figure 2. SOT-23 Maximum Power Dissipation vs. Temperature

ESD CAUTION