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NHSG017HT датащи(PDF) 6 Page - NICHIA CORPORATION

номер детали NHSG017HT
подробное описание детали  TYPE GREEN LED
PDF  13 Pages
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производитель  NICHIA [NICHIA CORPORATION]
домашняя страница  http://www.nichia.co.jp
Logo NICHIA - NICHIA CORPORATION

NHSG017HT датащи(HTML) 6 Page - NICHIA CORPORATION

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Nichia
STSE-CC6120A
<Cat.No.061023>
(4) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method and the dip soldering method.
· Recommended soldering conditions
Reflow Soldering
Dip Soldering
Hand Soldering
Lead Solder
Lead-free Solder
Pre-heat
Pre-heat time
Peak
temperature
Soldering time
Condition
120 ~ 150°C
120 sec. Max.
240°C Max.
10 sec. Max.
refer to
Temperature
- profile
1.
180 ~ 200°C
120 sec. Max.
260°C Max.
10 sec. Max.
refer to
Temperature
- profile
2.
(N2 reflow is
recommended.)
Pre-heat
Pre-heat time
Solder bath
temperature
Dipping time
100°C Max.
60 sec. Max.
260°C Max.
10 sec. Max.
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
Although the recommended soldering conditions are specified in the above table, reflow, dip or hand
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
[Recommended soldering pad design]
Use the following conditions shown in the figure.
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow.
It is recommended that the User use the nitrogen reflow method.
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· Dip soldering should not be done more than one time.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
60sec.Max.
Above 220
°C
120sec.Max.
Pre-heating
260°C Max.
10sec. Max.
1~ 5°C / sec.
1~ 5°C / sec.
180 ~ 200°C
<
1 : Lead Solder>
<
2 : Lead-free Solder>
60sec.Max.
Above 200
°C
120sec.Max.
Pre-heating
240°C Max.
10sec. Max.
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec.
120 ~ 150°C
: Solder resist
4
4
9.5
1.5
1.5
(Unit : mm)



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