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Nichia STSE-CC6046A

<Cat.No.060421>

6.RELIABILITY

(1) TEST ITEMS AND RESULTS

Test Item

Standard

Test Method

Test Conditions

Note

Number of

Damaged

Resistance to

Soldering Heat

(Reflow Soldering)

JEITA ED-4701

300 301

Tsld=260°C, 10sec.

(Pre treatment 30°C,70%,168hrs.)

2 times

0/50

Solderability

(Reflow Soldering)

JEITA ED-4701

300 303

Tsld=215 ± 5°C,

3sec.

(Lead Solder)

1 time

over 95%

0/50

Thermal Shock

JEITA ED-4701

300 307

0°C ~ 100°C

15sec. 15sec.

20 cycles

0/50

Temperature Cycle

JEITA ED-4701

100 105

-40°C ~ 25°C ~ 100°C ~ 25°C

30min. 5min. 30min. 5min.

100 cycles

0/50

High Temperature Storage

JEITA ED-4701

200 201

Ta=100°C

500 hrs.

0/50

Temperature Humidity

Storage

JEITA ED-4701

100 103

Ta=60°C, RH=90%

500 hrs.

0/50

Low Temperature Storage

JEITA ED-4701

200 202

Ta=-40°C

500 hrs..

0/50

Steady State Operating Life

Tested with Nichia standard circuit board.

500 hrs.

0/50

Steady State Operating Life

of High Temperature

Tested with Nichia standard circuit board.

500 hrs.

0/50

Steady State Operating Life

of High Humidity Heat

Tested with Nichia standard circuit board.

500 hrs.

0/50

Steady State Operating Life

of Low Temperature

Tested with Nichia standard circuit board.

500 hrs.

0/50

Vibration

JEITA ED-4701

400 403

100 ~ 2000 ~ 100Hz Sweep 4min.

3direction, 4cycles

48min.

0/50

Substrate Bending

JEITA ED-4702

3mm, 5 ± 1 sec.

1 time

0/50

Adhesion Strength

JEITA ED-4702

5N,

10 ± 1 sec.

1 time

0/50

Electrostatic Discharges

JEITA ED-4701

300 304

R=1.5k

Ω, C=100pF

Test Voltage=2kV

3 times

Negative/Positive

0/50

Thermal resistance of LED with Nichia standard circuit board : Rja ≒ 110°C/W

Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm

(2) CRITERIA FOR JUDGING DAMAGE

Criteria for Judgement

Item

Symbol

Test Conditions

Min.

Max.

Forward Voltage

-

Initial Level

1.1

Luminous Flux

φv

Initial Level

0.7

-

The test is performed after the board is cooled down to the room temperature.