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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ST72260G датащи(PDF) 155 Page - STMicroelectronics |
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ST72260G датащи(HTML) 155 Page - STMicroelectronics |
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155 / 171 page  ST72260G, ST72262G, ST72264G 155/171 Figure 111. Low Profile Fine Pitch Ball Grid Array Package 14.2 THERMAL CHARACTERISTICS Notes: 1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation determined by the user. 2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA. Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) SDIP32 SO28 LFBGA 6x6 (on multilayer PCB) LFBGA 6x6 (on single-layer PCB) 60 75 56 72 °C/W PD Power dissipation 1) 500 mW TJmax Maximum junction temperature 2) 150 °C Dim mm inches Min Typ Max Min Typ Max A 1.210 1.700 0.048 0.067 A1 0.270 0.011 A2 1.120 0.044 b 0.450 0.500 0.550 0.018 0.020 0.022 D 5.750 6.000 6.150 0.226 0.236 0.242 D1 4.000 0.157 E 5.750 6.000 6.150 0.226 0.236 0.242 E1 4.000 0.157 e 0.720 0.800 0.880 0.028 0.031 0.035 f 0.850 1.000 1.150 0.033 0.039 0.045 ddd 0.120 0.005 |
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