STTH8R04

Package information

9/11

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 8.

TO-220AC Ins. dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

15.20

15.90 0.598

0.625

a1

3.75

0.147

a2

13.00

14.00 0.511

0.551

B

10.00

10.40 0.393

0.409

b1

0.61

0.88

0.024

0.034

b2

1.23

1.32

0.048

0.051

C

4.40

4.60

0.173

0.181

c1

0.49

0.70

0.019

0.027

c2

2.40

2.72

0.094

0.107

e

4.80

5.40

0.189

0.212

F

6.20

6.60

0.244

0.259

ØI

3.75

3.85

0.147

0.151

I4

15.80 16.40 16.80 0.622 0.646 0.661

L

2.65

2.95

0.104

0.116

l2

1.14

1.70

0.044

0.066

M2.60

0.102

C

b2

c2

F

Ø I

L

A

a1

a2

B

e

b1

I4

l2

c1

M