Data Sheet

ADP150

APPLICATIONS INFORMATION

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Rev. E | 17 of 20

Figure 46. WLCSP, 100 mm2 of PCB Copper, Board Temperature = 85°C

PCB LAYOUT CONSIDERATIONS

Heat dissipation from the package can be improved by increasing

the amount of copper attached to the pins of the ADP150. However,

as listed in Table 7, a point of diminishing returns is reached

eventually, beyond which an increase in the copper size does not

yield significant heat dissipation benefits.

Place the input capacitor as close as possible to the VIN and

GND pins. Place the output capacitor as close as possible to the

VOUT and GND pins. Use of 0402 size or 0603 size capacitors and

resistors achieves the smallest possible footprint solution on boards

where area is limited.

Figure 47. Example TSOT PCB Layout

Figure 48. Example WLCSP PCB Layout