Data Sheet

ADG774A

Rev. C | Page 13 of 14

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-137-AB

CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

16

9

8

1

SEATING

PLANE

0.010 (0.25)

0.004 (0.10)

0.012 (0.30)

0.008 (0.20)

0.025 (0.64)

BSC

0.041 (1.04)

REF

0.010 (0.25)

0.006 (0.15)

0.050 (1.27)

0.016 (0.41)

0.020 (0.51)

0.010 (0.25)

8°

0°

COPLANARITY

0.004 (0.10)

0.065 (1.65)

0.049 (1.25)

0.069 (1.75)

0.053 (1.35)

0.197 (5.00)

0.193 (4.90)

0.189 (4.80)

0.158 (4.01)

0.154 (3.91)

0.150 (3.81)

0.244 (6.20)

0.236 (5.99)

0.228 (5.79)

Figure 29. 16-Lead Shrink Small Outline Package [QSOP]

(RQ-16)

Dimensions shown in inches and (millimeters)

3.10

3.00 SQ

2.90

0.30

0.25

0.20

1.65

1.50 SQ

1.45

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

EXPOSED

PAD

PIN 1

INDICATOR

0.50

0.40

0.30

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

0.20 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.80

0.75

0.70

COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-16-27)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADG774ABRQ-REEL7

−40°C to +85°C

16-Lead Shrink Small Outline Package [QSOP]

RQ-16

ADG774ABRQZ

−40°C to +85°C

16-Lead Shrink Small Outline Package [QSOP]

RQ-16

ADG774ABRQZ-REEL

−40°C to +85°C

16-Lead Shrink Small Outline Package [QSOP]

RQ-16

ADG774ABRQZ-REEL7

−40°C to +85°C

16-Lead Shrink Small Outline Package [QSOP]

RQ-16

ADG774ABCPZ-REEL

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-27

ADG774ABCPZ-R2

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-27

1 Z = RoHS Compliant Part.