R31DS0038EU0204 Rev.2.04

Page 4

Aug 14, 2026

551S Datasheet

2. Specifications

2.1

Absolute Maximum Ratings

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such

conditions can adversely impact product reliability and result in failures not covered by warranty.

2.2

Recommended Operating Conditions

2.3

Thermal Specifications

2.3.1

8-SOIC

2.3.2

8-TSSOP

Parameter

Rating

Supply Voltage, VDD

3.465V

All Inputs and Outputs

-0.5 V to 3.465V

Ambient Operating Temperature, Extended

-40 to +105°C

Storage Temperature

-65 to +150°C

Junction Temperature

125°C

Soldering Temperature

260°C

Parameter

Minimum

Maximum

Unit

Ambient Operating Temperature, extended

-40

+105



C

Power Supply Voltage (measured in respect to GND)

+1.71

+3.465

V

Parameter

Symbol

Conditions

Typical

Unit

Thermal Resistance Junction to Ambient

ΘJA

Still air

150

°C/W

1m/s air flow

140

3m/s air flow

120

Thermal Resistance Junction to Board

ΘJB

89

Thermal Resistance Junction to Case

ΘJC

40

Parameter

Symbol

Conditions

Typical

Unit

Thermal Resistance Junction to Ambient

ΘJA

Still air

149.1

°C/W

1m/s air flow

143.3

2m/s air flow

137.9

3m/s air flow

133.8

Thermal Resistance Junction to Board

ΘJB

153

Thermal Resistance Junction to Case

ΘJC

64.2