6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Input Voltage

VIN

-0.3

20

V

EN

-0.3

VIN + 0.3

V

Output voltage

VREF_S, VREF_F

-0.3

5.5

V

Output short circuit current

ISC

80

mA

Junction temperature

(TJ max)

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,

all pins(1)

±2000

V

V(ESD)

Electrostatic discharge

Charged device model (CDM), per JEDEC specification

JESD22-C101, all pins(2)

±500

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage

VREF + 0.2(1)

18

V

EN

Enable pin Voltage

0

VIN

V

IREF

Output current

–10

30

mA

TA

Operating ambient temperature

–40

25

125

°C

(1)

For VREF < 1.8V, the minimum supply voltage is 1.71V.

6.4 Thermal Information

THERMAL METRIC(1)

REF53-Q1

REF53-Q1

REF53-Q1

UNIT

DGK (VSSOP)

D (SOIC)

DDC (SOT-23-THN)

8 PINS

8 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance

154.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

93.6

°C/W

RθJB

Junction-to-board thermal resistance

61.9

°C/W

ΨJT

Junction-to-top characterization parameter

37.6

°C/W

ΨJB

Junction-to-board characterization parameter

61.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

www.ti.com

REF53-Q1

SNVSCU8 – AUGUST 2026

Copyright © 2026 Texas Instruments Incorporated

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