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DBVPACKAGE

(TOP VIEW)

DCKPACKAGE

(TOP VIEW)

YZP PACKAGE

(BOTTOMVIEW)

2

GND

V

CC

5

3

4

2A

2Y

6

1

1A

1Y

3

4

2A

2

GND

2Y

5

1

1A

V

CC

6

1Y

2

GND

V

CC

1

5

1A

2A

4

3

2Y

6

1Y

DESCRIPTION/ORDERING INFORMATION

SN74LVC2G07

DUAL BUFFER/DRIVER

WITH OPEN-DRAIN OUTPUTS

SCES308G – AUGUST 2001 – REVISED JANUARY 2007

• Available in the Texas Instruments

• Typical V

NanoFree™ Package

>2 V at V

• Supports 5-V V

• I

Operation

• Inputs and Open-Drain Outputs Accept

Voltages up to 5.5 V

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• Max t

• ESD Protection Exceeds JESD 22

• Low Power Consumption, 10-µA Max I

CC

–

2000-V Human-Body Model (A114-A)

• ±24-mA Output Drive at 3.3 V

–

200-V Machine Model (A115-A)

• Typical V

<0.8 V at V

–

1000-V Charged-Device Model (C101)

drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high

wired-AND functions. The maximum sink current is 32 mA.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

Reel of 3000

SN74LVC2G07YZPR

_ _ _CV_

0.23-mm Large Bump – YZP (Pb-free)

SOT (SOT-23) – DBV

Reel of 3000

SN74LVC2G07DBVR

C07_

–40

°C to 85°C

Reel of 3000

SN74LVC2G07DCKR

SOT (SC-70) – DCK

CV_

Reel of 250

SN74LVC2G07DCKT

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2001–2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.