MCP14E6/7/8

DS20005006B-page 4

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Propagation Delay Time

tD3

—35

65

ns

VDD =12V, Figure 4-3

Propagation Delay Time

tD4

—35

65

ns

VDD =12V, Figure 4-3

Power Supply

Supply Voltage

VDD

4.5

—

18.0

V

Supply Current

IDD

—

1000

1800

µA

VIN_A =3V, VIN_B =3V,

ENB_A = ENB_B = High

IDD

—

600

900

µA

VIN_A =0V, VIN_B =0V,

ENB_A = ENB_B = High

IDD

—

800

1600

µA

VIN_A =3V, VIN_B =0V,

ENB_A = ENB_B = High

IDD

—

800

1600

µA

VIN_A =0V, VIN_B =3V,

ENB_A = ENB_B = High

IDD

—

600

1000

µA

VIN_A =3V, VIN_B =3V,

ENB_A = ENB_B = Low

IDD

—

300

450

µA

VIN_A =0V, VIN_B =0V,

ENB_A = ENB_B = Low

IDD

—

500

800

µA

VIN_A =3V, VIN_B =0V,

ENB_A = ENB_B = Low

IDD

—

500

800

µA

VIN_A =0V, VIN_B =3V,

ENB_A = ENB_B = Low

DC CHARACTERISTICS (OVER OPERATING TEMP. RANGE)(2)

Electrical Specifications: Unless otherwise indicated, operating temperature range with 4.5V

 VDD  18V.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Input

Logic ‘1’, High Input Voltage

VIH

2.4

—

—

V

Logic ‘0’, Low Input Voltage

VIL

——

0.8

V

Input Current

IIN

-10

—

+10

µA

0V

 VIN  VDD

Output

High Output Voltage

VOH

VDD – 0.025

—

—

V

DC Test

Low Output Voltage

VOL

—

—

0.025

V

DC Test

Output Resistance, High

ROH

—8

11

IOUT =10mA, VDD =18V

Output Resistance, Low

ROL

—8

11

Ω

IOUT =10mA, VDD =18V

Switching Time(1)

Rise Time

tR

—23

35

ns

Figure 4-1, Figure 4-2,

CL = 1000 pF

Fall Time

tF

—23

40

ns

Figure 4-1, Figure 4-2,

CL = 1000 pF

Propagation Delay Time

tD1

—50

65

ns

Figure 4-1, Figure 4-2

Propagation Delay Time

tD2

—50

65

ns

Figure 4-1, Figure 4-2

Note 1: Switching times are ensured by design.

2: Tested during characterization, not production tested.

DC CHARACTERISTICS(2) (CONTINUED)

Electrical Specifications: Unless otherwise indicated, TA = +25°C, with 4.5V  VDD  18V.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Note 1: Switching times are ensured by design.

2: Tested during characterization, not production tested.

3: Package power dissipation is dependent on the copper pad area of the PCB.