RA4M3 datasheet(32/98 Pages) RENESAS

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2.2.6

VCC Rise and Fall Gradient and Ripple Frequency

Table 2.9

Rise and fall gradient characteristics

Parameter

Symbol

Min

Typ

Max

Unit

Test

conditions

VCC rising gradient

Voltage monitor 0 reset disabled at startup

SrVCC

0.0084 —

ms/V

—

Voltage monitor 0 reset enabled at startup

0.0084 —

—

SCI/USB boot mode*1

0.0084 —

—

VCC falling gradient*2

SfVCC

0.0084 —

—

ms/V

—

Note 1. At boot mode, the reset from voltage monitor 0 is disabled regardless of the value of the OFS1.LVDAS bit.

Note 2. This applies when VBATT is used.

Table 2.10

Rising and falling gradient and ripple frequency characteristics

The ripple voltage must meet the allowable ripple frequency fr(VCC) within the range between the VCC upper limit (3.6 V) and lower limit (2.7

V). When the VCC change exceeds VCC ±10%, the allowable voltage change rising and falling gradient dt/dVCC must be met.

Parameter

Symbol

Min

Typ

Max

Unit

Test conditions

Allowable ripple

frequency

fr (VCC)

—

kHz

Figure 2.6

Vr (VCC) ≤ VCC × 0.2

—

MHz

Figure 2.6

Vr (VCC) ≤ VCC × 0.08

—

MHz

Figure 2.6

Vr (VCC) ≤ VCC × 0.06

Allowable voltage

change rising and

falling gradient

dt/dVCC

1.0

—

ms/V

When VCC change

exceeds VCC ±10%

Vr(VCC)

VCC

1 / fr(VCC)

Figure 2.6

Ripple waveform

2.2.7

Thermal Characteristics

Maximum value of junction temperature (Tj) must not exceed the value of “section 2.2.1. Tj/Ta Definition”.

Tj is calculated by either of the following equations.

● Tj = Ta + θja × Total power consumption

● Tj = Tt + Ψjt × Total power consumption

– Tj : Junction Temperature (°C)

– Ta : Ambient Temperature (°C)

– Tt : Top Center Case Temperature (°C)

– θja : Thermal Resistance of “Junction”-to-“Ambient” (°C/W)

– Ψjt : Thermal Resistance of “Junction”-to-“Top Center Case” (°C/W)

RA4M3 Datasheet

2. Electrical Characteristics

R01DS0368EJ0150 Rev.1.50

Apr 25, 2025

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