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Package information

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Package information

Figure 15.

Recommended footprint (dimensions in mm)

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 3.

SOT323-5L dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Max.

Min.

Max.

A

0.8

1.1

0.031

0.043

A1

0

0.1

0

0.004

A2

0.8

1

0.031

0.039

b

0.15

0.3

0.006

0.012

c

0.1

0.18

0.004

0.007

D

1.8

2.2

0.071

0.086

E

1.15

1.35

0.045

0.053

e

0.65 Typ.

0.025 Typ.

H

1.8

2.4

0.071

0.094

Q1

0.1

0.4

0.004

0.016

A1

A2

A

L

HE

c

Q1

b

E

D

e

e

0.3

1.0

1.0

2.9

0.35