M58WR064EB datasheet(81/82 Pages) STMICROELECTRONICS

81 / 82 page

81/82

M58WR064ET, M58WR064EB

REVISION HISTORY

Table 44. Document Revision History

Date

Version

Revision Details

08-Apr-2002

-01

First Issue

20-Jun-2002

-02

Part number modified, Synchronous Burst Frequency modified, description of the

Automatic Standby mode added.

Hexadecimal Code for Quadruple Word Program Setup modified.

Double/Quadruple Word Program command descriptions modified.

Description of the Verify Phase in the Enhanced Factory Program command and the

Exit Phase in the Quadruple Enhanced Factory Program command modified.

Parameters in Tables 6, 7, 8, 18, 20, 21, 22, 23, 24, 33, 39, 40, 41 and 43 modified

and/or specified. Figures 4, 7, 12, 13, 15, 16, 17 and 23 modified. Figure 14 added.

21-Oct-2002

2.1

Revision numbering modified: a minor revision will be indicated by incrementing the

digit after the dot, and a major revision, by incrementing the digit before the dot

(revision version 02 equals 2.0).

Revision history moved to end of document.

Bank numbering modified; Figures 21, 22, 23, 24, 27, 28 and 29 modified. 1st Cycle

Addresses modified in Table 5 and note to Figure 13, modified.

“Read Status Register Command”, “Program/Erase Suspend Command”, “Set

Configuration Register Command”, “Double Word Program Command”, “Quadruple

Word Program Command”, “Enhanced Factory Program Command”, “Quadruple

Enhanced Factory Program Command”, “Erase Status Bit (SR5)”, “Wait

Configuration Bit (CR8)”, “Asynchronous Read Mode”, “Synchronous Burst Read

Mode” and “Single Synchronous Read Mode” paragraphs clarified.

Default values added to Table 9; Figure 19, VFBGA56 Daisy Chain - Package

Connections (Top view through package), Figure 20, VFBGA56 Daisy Chain - PCB

Connection Proposal (Top view through package) and Table 27, Daisy Chain

Ordering Scheme added.

Notes added to Figures 12, 21, 22, 23, 24, 27, and 28 and Table 14.

85ns Speed Class removed, 80ns Speed Class added.

70ns Speed Class characterized (certain timings modified).

19-Feb-2003

3.0

Document promoted from Product Preview to full Datasheet status.

Automatic Standby mode explained under Asynchronous Read Mode. Minor text

changes in Clear Status Register Command, Quadruple Enhanced Factory Program

Command and Synchronous Burst Read Mode.

Bank Erase Command moved from the Standard to the Factory Program

Commands. Number of Bank Erase cycles limited to 100. Erase replaced by Block

Erase in Tables 11 and 12, Dual Operations Allowed in Other Banks and the Same

Bank, respectively.

Overbar removed from WAIT signal in all AC Waveform Figures. Latch Enable

waveform modified in Figure 11, Asynchronous Page Read AC Waveforms.

VDDQ range split into two in Tables 20 and 21, Asynchronous and Synchronous Read

AC Characteristics: for VDDQ = 1.65V to 2.2V, tAVKH and tELKH in Table 20, and tLLKH

in Table 21, were changed; for VDDQ = 2.2V to 3.3V, tAVQV1, tELTV, tEHTZ, tEHQZ,

tGLQV, tAVLH, tLLH in Table 20 and all the timings in Table 21 were modified.

Values corrected in Table 25, VFBGA56 - 7.7x9mm, 8x7 ball array, 0.75mm pitch,

Package Mechanical Data.

Data reserved at addresses 35h and 38h in Table 33, Device Geometry Definition.

Data corrected at address offset (P+37)h = 70h in Table 39, Bank and Erase Block

Region 2 Information. Quotes removed from Figure 21, Program Flowchart and

Pseudo Code.

M58WR064EB датащи(PDF) 81 Page - STMicroelectronics

M58WR064EB датащи(HTML) 81 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82

датащи скачать

ссылки URL