ISL28107, ISL28207, ISL28407

FN6631 Rev 8.01

Page 28 of 32

Aug 30, 2024

Sep7, 2010

3.00

1. General changes:

a. Added in ISL28407 Quad devices for SOIC, TSSOP and QFN packages.

b. Added in TDFN packages for single ISL28107 and dual ISL28207 devices.

c. Added in new VOS and TCVOS limits for TDFN packages

2. Specific changes:

a. On page 1 – Added in ISL28407 to title and front page info. Corrected Input Bias Current in Features from 60pA

to 15pA (in order to match Spec Table)

b. On page 3 - Added in ISL28107FRTZ, ISL28207FRTZ, ISL28407FBZ, ISL28407FVZ, and ISL28407FRZ packages

to Ordering information. Added in –T7, T-13 & -T7A tape and reel extensions where applicable.

c. On page 3 -Corrected part marking for ISL28207FRTZ parts from 207Z to 8207

d. On page 3 – Added in TDFN, 14 Ld SOIC, 14 Ld TSSOP and 16 Ld QFN to pin configurations.

e. On page 4 – Updated “Pin Descriptions” with newly added packages.

f. On page 6 – in “Thermal Information”, added in thermal packaging info & applicable notes for TDFN packages.

g. On page 6 and page 7 Electrical Specifications Tables – Added two new line items for VOS spec. TDFN package

ISL28107 limits ±100uV 25C and ±190uV full temp. TDFN package ISL28207 limits ±100uV 25C and ±175uV full

temp.

h. On page 6 and page 7 Electrical Specifications Table – Added two new line items for TCVOS spec. TDFN package

ISL28107 limits ±0.9uV/C full temp. TDFN package ISL28207 limits ±0.75uV/C.

i. On page 30 to page 34 - Added in POD for L8.3x3A, M14.15, M14.173, and L16.4x4

Mar 9, 2010

2.00

1. Added MSOP package to the ordering information and added applicable POD M8.118 to end of datasheet

2. Separated each part number with it's own specific -T7 and -T13 suffix. Removed “Add

“-T7” or “-T13” suffix for Tape and Reel.” from Note 1.

3. Added MSOP to the Pin Configuration and Pin Descriptions

4. Updated ±15 and ±5V Electrical Specification table with the following edits:

A) Separated VOS specs for SOIC and MSOP packages. Added new VOS specs for MSOP Grade package.

B) Separated TCVOS specs for SOIC and MSOP packages. Added new TCVOS specs for MSOP package.

5. Added Theta JA and JC for the 8 Ld MSOP package. Added Theta JC values for both SOIC package options.

Changed Theta JA for 8 Ld SOIC (ISL28207) from 115 to 105.

Feb 22, 2010

1. Added “Related Literature*(see page 26)” on page 1.

2. Added Evaluation Boards to “Ordering Information” on page 3.

3. “Electrical Specifications” Tables, page 6 to page 10. Unbolded MIN/MAX specs with “TA = -40°C to +85°C”

conditions (since only MIN/MAX specs with “TA = -40°C to +125°C” conditions should be bolded, per note in

common conditions)

4. Corrected Note reference in ISC parameter on page 7 and page 10 from Note 3 to Note 9.

Nov 10, 2009

1.00

1. Updated VOS, IB, and IOS electrical specifications.

2. Added Typical performance curves, Figures 3 through 32.

3. Output Short Circuit Current test condition has been clarified with Note 9.

4. Updated POD.

5. Added Spice Model, associated text and Figures 58 through 68.

6. Deleted old Figures 6, 7, 8, 10, 11 and 12.

7. Added Licence Statement on page 16 and referenced in spice model.

Jun 5, 2009

0.00

Initial Release

The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that

you have the latest revision. (Continued)

DATE

REVISION

CHANGE